MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks and Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks.
ميديا تيك (MediaTek)
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
7.5
Key differences
| MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | MediaTek | Qualcomm (Samsung-exclusive) |
| Fabrication | 4 nm (TSMC N4P) | 3nm |
| Announced | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro | December 2025 |
| Availability | Available | Exclusive to one phone model |
| Architecture | ARMv9.2-A, 64-bit | Oryon (first generation) |
| GPU | Mali-G720 MC8 | Adreno (customized for the original Elite tier) |
| Key features | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving | Custom-tuned for running two displays in a tri-folding phone |
| Phones using it | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 | Samsung Galaxy Z TriFold |
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.
- +An all-big-core design that delivers very strong processing performance
- +Top-tier LPDDR5X memory and UFS 4.1 storage
- +Advanced generative AI support via the NPU 880
- −Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
- −Less consistent performance during long gaming sessions
- −Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks
A special variant of the Snapdragon 8 Elite tuned for the power needs of the Samsung Galaxy Z TriFold, Samsung's first tri-folding phone.
- +Custom power tuning accounting for the tri-fold form factor.
- +Supports running two displays simultaneously efficiently.
- +Joint development with Samsung ensures precise device fit.
- −Based on the previous Snapdragon 8 Elite generation, not the newer Gen 5.
- −Exclusive to a single phone model as of this review.
Full specifications
| MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | MediaTek | Qualcomm (Samsung-exclusive) |
| Fabrication | 4 nm (TSMC N4P) | 3nm |
| Announced | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro | December 2025 |
| Availability | Available | Exclusive to one phone model |
| CPU | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores | — |
| Max clock | 3.4 GHz | — |
| Architecture | ARMv9.2-A, 64-bit | Oryon (first generation) |
| Graphics & AI | ||
| GPU | Mali-G720 MC8 | Adreno (customized for the original Elite tier) |
| GPU clock | ~1300–1500 MHz (slight variation between sources) | — |
| NPU | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) | — |
| AI performance | No specific figure announced by MediaTek | — |
| Memory & connectivity | ||
| Supported RAM | LPDDR5X | — |
| Max RAM | Up to 9600 Mbps | — |
| Supported storage | UFS 4.1 | — |
| Modem | Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation | — |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6E | — |
| Bluetooth | 5.4 | — |
| Benchmarks | ||
| AnTuTu | ~2,136,906 | — |
| Geekbench single-core | ~1,708 – 1,725 | — |
| Geekbench multi-core | ~6,297 – 6,860 | — |
| Extra features | ||
| Key features | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving | Custom-tuned for running two displays in a tri-folding phone |
| Phones using it | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 | Samsung Galaxy Z TriFold |
Other comparisons
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Google Tensor G6 Chipset Review — Specifications and Benchmarks
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Samsung Exynos 1580 Processor Review
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Samsung Exynos 1480 Chipset Review — Specifications and Benchmarks
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks